MediaTek announced the Helio X30
lastsummer and we are expecting the first phones with it to come in Q2 2017. Now we hear the Chinese is planning a major jump forward with its next SoC. The new chipset will be made on a 7nm process and will have 12 cores, sources report.
Despite experiencing unsatisfactory yield rates for TSMC’s 10nm process, MediaTek will continue to partner with the foundry to make its next-generation flagship mobile chips, according to industry sources.
TSMC will enter risk production for a MediaTek chip on the newer 7nm process in the second quarter, said the sources, adding that the SoC incorporates 12 CPU cores.
TSMC disclosed previously the node technology will be ready for risk production later in the first quarter.
In addition, speculation has circulated that the low yield rates for TSMC’s 10nm process could affect shipments of MediaTek’s Helio X30 chips. In response, MediaTek claimed there is no change to the shipment schedule.
MediaTek announced the Helio X30 last summer and we are expecting the first phones with it to come in Q2 2017. Now we hear the Chinese is planning a major jump forward with its next SoC. The new chipset will be made on a 7nm process and will have 12 cores, sources report.
MediaTek in February rolled out its 10nm Helio X30-series SoC designed for high-end smartphones. Mass production for the deca-core SoC has kicked off, said the company, adding that commercial devices powered by the chips will be available in the second quarter of 2017.
The report says that Mediatek and TSMC are working together in bringing an even more efficient chipset to life. The 7nm SoC will have 12 cores, up from 10 in the Helio X30. Despite experiencing unsatisfactory yield rates for TSMC’s 10nm process, Mediatek will keep working together with the Taiwan company for its next-generation SoC.